Propiedades morfológicas y estructurales de recubrimientos nitruro de titanio aluminio producidos por magnetron sputtering tríodo
Main Article Content
Keywords
TiAlN, voltaje de polarización, sputtering, procentaje atómico, XRD.
Resumen
Se crecieron recubrimientos de TixAl1-xN empleando la técnica de magnetron sputtering tríodo, variando el voltaje de polarización entre -40 V y -150V. Por medio de espectroscopía de energía dispersiva, difracción de rayos x y miscroscopía de fuerza atómica, se analizó la influencia del voltaje de polarización sobre las propiedades morfológicas y estructurales de los recubrimientos. A medida que el voltaje bias se incrementó, se observó un aumento en el porcentaje atómico de Al, compitiendo con la concentración de Ti y produciendo cambios estructurales. A bajas concentraciones de Al, la pelcula exhibió una estructura cristalina FCC; sin embargo, a medida que le porcentaje de Al disminuyó, se pudo detectar una mezcla de fases FCC y HCP. Por otro lado, el incremento en el voltaje de polarización produjo una disminución en el espesor de las películas, debido al aumento en el número de colisiones. Además, el tamaño de grano y la rugosidad se vieron fuertemente afectados por el voltaje bías.
PACS:61.05.cp
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Referencias
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machining applications,” Surface and Coatings Technology, vol. 177-178, pp. 800–811, 2004.
[3] H. K. Tönshoff, B. Karpuschewski, A. Mohlfeld, and H. Seegers, “Influence of subsurface properties on the adhesion strength of sputtered hard coatings,” Surface and Coatings Technology, vol. 116–119, pp. 524–529, 1999.
[4] S. K. Wu, H. C. Lin, and P. L. Liu, “An investigation of unbalancedmagnetron sputtered TiAlN films on SKH51 high-speed steel,” Surface and Coatings Technology, vol. 124, pp. 97–103, 2000.
[5] D.-Y. Wang, Y.-W. Li, and W.-Y. Ho, “Deposition of high quality (Ti,Al)N hard coatings by vacuum arc evaporation process,” Surface and Coatings Technology, vol. 114, pp. 109–113, 1999.
[6] B. Subramanian, R. Ananthakumar, and M. Jayachandran, “Microstructural, mechanical and electrochemical corrosion properties of sputtered titaniumaluminum-nitride films for bio-implants,” Surface and Coatings Technology, vol. 85, pp. 601–609, 2010.
[7] E. Lugscheider, F. L. O. Knotek, C. Barimani, S. Guerreiro, and H. Zimmermann, “Deposition of arc TiAlN coatings with pulsed bias,” Surface and Coatings Technology, vol. 76–77, pp. 700–705, 1995.
[8] Y. P. Kathuria and Y. Uchida, “Pulsed Nd-YAG laser deposition of TiN and TiAlN coating,” Physics Procedia, vol. 12, pp. 506–511, 2011.
[9] Y. Q.Wei, C. W. Li, C. Z. Gong, X. B. Tian, and S. Q. Yang, “Microstructure and mechanical properties of TiN/TiAlN multilayer coatings deposited by arcion plating with separate targets,” Transactions of Nonferrous Metals Society
of China, vol. 21, pp. 1068–1073, 2011.
[10] J. L. R. M. L. C. Fontana, “Characteristics of triode magnetron sputtering: the morphology of deposited titanium films,” Surface and Coatings Technology, vol. 107, pp. 24–30, 1998.
[11] P. Panjan, B. Navinsek, M. Cekada, and A. Zalar, “Oxidation behaviour of TiAlN coatings sputtered at low temperature,” Vacuum, vol. 53, pp. 127–131, 1999.
[12] H. C. Barshilia, A. Ananth, J. Khan, and G. Srinivas, “ Ar + H2 plasma etching for improved adhesion of PVD coatings on steel substrates ,” Vacuum, vol. 86, pp. 1165–1173, 2012.
[13] M. Panjan, M. Cekada, P. Panjan, F. Zupani, and W. Kölker, “Dependence of microstructure and hardness of TiAlN/VN hard coatings on the type of substrate rotation,” Vacuum, vol. 86, pp. 699–702, 2012.
[14] G. Greczynski, M. J. J. Lu, J. Jensen, I. Petrov, J. Greene, and L. Hultman, “Selection of metal ion irradiation for controlling Ti1